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Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio

Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
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Stock Market | FinancialContent Business Page

Stock Market | FinancialContent Business Page
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Global Unichip : Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies May. 16, 2023 News Content: Cadence 112G-LR SerDes. | May 16, 2023

Glink cowoSanjive agarwalaDan kochpatcharinIgor elkanovichGlobal unichip corpIp group at cadenceDesign infrastructure management divisionCompanies to workCadence design systems incDesign systemsGlobal unichipIntelligent system designIntelligent system design strategyCadence design systemsGlobal unichip corp stock exchangePress release

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
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Dan kochpatcharinIgor elkanovichSanjive agarwalaGlink cowoIp group at cadenceGlobal unichip corpDesign infrastructure management divisionCadence design systems incDesign systemsGlobal unichipIntelligent system design

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

SAN JOSE, Calif., April 26, 2023 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC). This milestone in the companies’ ongoing and successful collaboration solidifies Cadence’s leadership in high-performance connectivity IP for the high-bandwidth, high-reliability products that power the…

Sanjive agarwalaGlink cowoDan kochpatcharinIgor elkanovichGlobal unichip corpCadence design systems incIp group at cadenceDesign infrastructure management divisionCadence design systemsGlobal unichipIntelligent system designIntelligent system design strategy