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Global Unichip : Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

SAN JOSE, Calif., April 26, 2023  Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC). This milestone in the companies’ ongoing and successful collaboration solidifies Cadence’s leadership in high-performance connectivity IP for the high-bandwidth, high-reliability products that power the…

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
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Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
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