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UCIe Die-to-Die Controller IP Core

UCIe Die-to-Die Controller IP Core
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Adapter-layer

Ampere announces monstrous 256-core 3nm CPU, teams up with Qualcomm for AI

Ampere announces monstrous 256-core 3nm CPU, teams up with Qualcomm for AI
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Ampere Reveals 256-Core Server CPU, AI Partnership With Qualcomm In Big Update

Ampere Reveals 256-Core Server CPU, AI Partnership With Qualcomm In Big Update
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ISC 2024's Wednesday Keynote: Two Trends Transforming HPC - High-Performance Computing News Analysis

ISC 2024's Wednesday Keynote: Two Trends Transforming HPC - High-Performance Computing News Analysis
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Want to Mix and Match Dies in a Single Package? UCIe Can Get You There

As Moore’s law slows, engineering ingenuity has created innovative ways to push the boundaries of physics. Multi-die chip designs, whose heterogeneous .

Synopsys
Universal-chiplet-interconnect-express
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