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Intel s 288-Core Clearwater Forest Xeon CPU to Utilize Foveros 3D Stacking: Report

Intel s 288-Core Clearwater Forest Xeon CPU to Utilize Foveros 3D Stacking: Report
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3D chip stacking tech competition intensifying

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking.

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