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Intel s new 3D Foveros packaging tech: LEGO-like chiplets for CPUs
Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future.
Meteor lake
Arrow lake
Lunar lake
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Gen core
Foveros omni
Foveros direct
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Soc tile
Base tile
Intel next
Ntel 3d foveros
Intel meteor lake
Intel arrow lake
Intel lunar lake
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