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Intel CEO: we want 1 trillion transitors in a single package by 2030
Intel CEO Pat Gelsinger says at Hot Chips 34 that the company wants to hit 1 trillion transistors on a single package by 2030, Foveros will help them.
Pat gelsinger
Hot chips
Gen core
Meteor lake
Arrow lake
Global foundries
Ot chips 34
Ntel 3d foveros
3d foveros
Ntel 3d foveros packaging technology
Intel meteor lake
Ntel 1 trillion transistors
Pat gelsinger
Intel ceo pat gelsinger
Intel s new 3D Foveros packaging tech: LEGO-like chiplets for CPUs
Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future.
Meteor lake
Arrow lake
Lunar lake
Hot chips
Gen core
Foveros omni
Foveros direct
Bump pitch
Bump density
Soc tile
Base tile
Intel next
Ntel 3d foveros
Intel meteor lake
Intel arrow lake
Intel lunar lake
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