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AMD shows off more 3D-stacking technologies at Hot Chips 33

The 3D V-Cache shown off by AMD at Computex is the (relatively) simple addition of further L3 cache to a Ryzen 9 5900X, bringing around a ~15%.

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AMD provides more 3D stacking info at Hot Chips 33 - Industry - News

AMD provides more 3D stacking info at Hot Chips 33 - Industry - News
hexus.net - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from hexus.net Daily Mail and Mail on Sunday newspapers.

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AMD provides more 3D stacking info at Hot Chips 33

AMD provides more 3D stacking info at Hot Chips 33
hexus.net - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from hexus.net Daily Mail and Mail on Sunday newspapers.

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Intel Reveals Future Roadmap: New Innovations and Partnerships

Intel also noted that its new and next-gen technologies were developed in close collaboration with partners in both the U.S. and Europe, which the company said are “key to bringing foundational innovations from the lab to high-volume manufacturing.”

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Intel mění své výrobní názvosloví

SdÃlet Email Kindle Twitter LinkedIn SdÃlet Intel mÄnÃ zpÅ¯sob charakterizace svÃ½ch mikroprocesorÅ¯. Jejich velikost bude novÄ udÃ¡vÃ¡na nikoliv v nanometrech, ale v angstromech a stejnÄ tak se mÄnÃ terminologie souvisejÃcÃ s vÃ½robnÃm procesem. NapÅÃklad stÃ¡vajÃcÃ 10nm Enhanced SuperFIN proces bude novÄ nazÃ½vÃ¡n Intel 7. Jde sice jen o nÃ¡zvoslovÃ, ovÅ¡em podloÅ¾enÃ© technikÃ¡liemi. VÃ½robci jako Intel a AMD dlouhÃ¡ lÃ©ta definovali evoluci svÃ½ch produktÅ¯ prostÅednictvÃm procesnÃch technologiÃ, nejdÅÃv v mikronech, pozdÄji v nanometrech. Definice 7nm procesu se vÅ¡ak postupnÄ stala natolik abstraktnÃ, Å¾e dle Intelu prakticky pozbyla vÃ½znamu. Proto firma hodlÃ¡ najet na novou metriku: vÃ½kon na watt.

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