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Intel CEO: we want 1 trillion transitors in a single package by 2030

Intel CEO Pat Gelsinger says at Hot Chips 34 that the company wants to hit 1 trillion transistors on a single package by 2030, Foveros will help them.

Intel s new 3D Foveros packaging tech: LEGO-like chiplets for CPUs

Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future.

Intel will share more about Meteor and Arrow Lake processors at Hot Chips

This year's Hot Chip Symposium schedule has been published, and there are some pleasant surprises. Besides AMD, Tesla and Nvidia, Intel will also hold various presentations to share details about its upcoming products, including the Meteor and Arrow Lake chips. Due to the pandemic, Hot Chips 34 will be held as a virtual event, running …

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