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Die Bonder Equipment Market to grow by $ 78.36 Million | COVID-19 Impact Analysis, Key Drivers, Trends, and Products Offered by Major Vendors


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NEW YORK, April 6, 2021 /PRNewswire/
The global die bonder equipment market is expected to grow by USD 78.36 million, exhibiting a CAGR of almost 2% during 2021-2025, according to Technavio s latest market report. Based on our research, the
semiconductor equipment sector witnessed a
mixed impact due to the widespread growth of the COVID-19 pandemic. The report also throws light on the pre- and post-impact of COVID-19 on businesses.
Technavio has announced its latest market research report titled Die Bonder Equipment Market by End-user and Geography - Forecast and Analysis 2021-2025
The OSATs segment will generate maximum revenue in the die bonder equipment market, owing to the need for a rise in the production capacity and constant technological innovations in semiconductor packaging techniques. In terms of geography, APAC will present significant opportunities for market vendors due to the growing production of smartphones, tablets, ....

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UPDATE 1-BE Semiconductor's Q1 orders more than double amid surging demand


By Reuters Staff
(Adds detail from statement, background)
April 6 (Reuters) - Dutch firm BE Semiconductor Industries (BESI) on Tuesday reported record orders for the first quarter, as surging demand helped more than double the amount booked the previous quarter.
The group, which makes equipment for chipmakers, said in a statement it had booked record orders of 327 million euros ($386.12 million) for the quarter, up 108% from the previous quarter and 176% from the same quarter of 2020.
BESI noted particularly strong demand for high-end smart phone applications linked to 5G products, as well as more demand for automotive applications and logic devices used in artificial intelligence and data centres. ....

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