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Die Bonder Equipment Market to grow by $ 78.36 Million | COVID-19 Impact Analysis, Key Drivers, Trends, and Products Offered by Major Vendors

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NEW YORK, April 6, 2021 /PRNewswire/
The global die bonder equipment market is expected to grow by USD 78.36 million, exhibiting a CAGR of almost 2% during 2021-2025, according to Technavio s latest market report. Based on our research, the
semiconductor equipment sector witnessed a
mixed impact due to the widespread growth of the COVID-19 pandemic. The report also throws light on the pre- and post-impact of COVID-19 on businesses.
Technavio has announced its latest market research report titled Die Bonder Equipment Market by End-user and Geography - Forecast and Analysis 2021-2025
The OSATs segment will generate maximum revenue in the die bonder equipment market, owing to the need for a rise in the production capacity and constant technological innovations in semiconductor packaging techniques. In terms of geography, APAC will present significant opportunities for market vendors due to the growing production of smartphones, tablets, ....

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Global Wire Bonder Equipment Industry (2020 to 2027) - Market Trends and Drivers

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ResearchAndMarkets.com s offering.
The publisher brings years of research experience to the 8th edition of this report. The 184-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.
Global Wire Bonder Equipment Market to Reach $1.2 Billion by 2027
Amid the COVID-19 crisis, the global market for Wire Bonder Equipment estimated at US$1 Billion in the year 2020, is projected to reach a revised size of US$1.2 Billion by 2027, growing at a CAGR of 1.7% over the analysis period 2020-2027. ....

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