The global bonding capillaries market is anticipated to grow from USD 1.60 Billion in 2023 to USD 2.52 Billion by 2030, at a CAGR of 6.70 % during the forecast period.
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NEW YORK, April 6, 2021 /PRNewswire/
The global die bonder equipment market is expected to grow by USD 78.36 million, exhibiting a CAGR of almost 2% during 2021-2025, according to Technavio s latest market report. Based on our research, the
semiconductor equipment sector witnessed a
mixed impact due to the widespread growth of the COVID-19 pandemic. The report also throws light on the pre- and post-impact of COVID-19 on businesses.
Technavio has announced its latest market research report titled Die Bonder Equipment Market by End-user and Geography - Forecast and Analysis 2021-2025
The OSATs segment will generate maximum revenue in the die bonder equipment market, owing to the need for a rise in the production capacity and constant technological innovations in semiconductor packaging techniques. In terms of geography, APAC will present significant opportunities for market vendors due to the growing production of smartphones, tablets, and other consumer el