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Red Hat OpenShift integrates with Apex Cloud for AI use cases

Discussing the integration of Dell Apex Cloud into Red Hat OpenShift to simplify AI-related use cases for enterprises at Red Hat Summit 2024.

Michael dellRebecca knightAndy jassyPat gelsingerMichael wellsIan pilcherRed hatRed hat incDell technologies incCube researchDell technologiesRed hat openshiftMicrosoft azureRob strechayRed hat summitApex cloud

iTWire - Advent One Secures Acceptance As APAC s First Partner In The Red Hat Partner Practice Accelerator Program

COMPANY NEWS:  Advent One, the reputable automation, cloud, and infrastructure specialist in Australia, proudly announces its acceptance int.

New zealandGarry grayTalor hollowayRed hat partner acceleration programRed hat partner practice accelerator programRed hatAdvent oneRed hat ansible automation platformRed hat ansibleRed hat openshiftSenior director

TheCUBE key findings from IBM Think as Big Blue plants itself in AI middleware

TheCUBE highlights three insights from its coverage of IBM Think 2024, which saw analysts and tech leaders gather to discuss the future of AI integration.

Pat gelsingerRitika gunnarMichael dellAndy jassyShelly kramerHillery hunterSanjeev mohanVarun biljaniVarun bijlaniZeus kerravalaAmazon web services incIbm corpZk researchRed hatCube researchInternational data corp

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology TOKYO, June 3, 2024 /PRNewswire/ Rapidus Corporation, a manufacturer of.

United statesMiki yagiAtsuyoshi koikeTakano okumotoDevan gillickKunihiko yasueIndustrial technology development organizationGeneration semiconductorsManufacturing technologyBreakaway communicationsJapan new energyRapidus corporationDevelopment of chipletPrnewswire rapidus corporationPackage designNew energy

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
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United statesKunihiko yasueTakano okumotoDevan gillickAtsuyoshi koikeMiki yagiDevelopment of chipletPrnewswire rapidus corporationJapan new energyRapidus corporationBreakaway communicationsCollaboration to chiplet packaging technologyGeneration semiconductorsIndustrial technology development organizationManufacturing technologyChiplet packaging technology