Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology
TOKYO, June 3, 2024 /PRNewswire/ Rapidus Corporation, a manufacturer of.
Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors tmcnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from tmcnet.com Daily Mail and Mail on Sunday newspapers.
Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM , today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this.