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Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors : comparemela.com
Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology
TOKYO, June 3, 2024 /PRNewswire/ -- Rapidus Corporation, a manufacturer of...
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