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Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0; Demonstrates Industry's First Working Silicon Compliant with the Spec

/PRNewswire/ Eliyan Corporation, credited for the invention of the semiconductor industry s highest-performance and most efficient chiplet interconnect,. ....

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Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution

SANTA CLARA, Calif. – January 24, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization efforts, bringing its expertise to enable more universal and cost-effective methods for implementing die-to-die interconnect in heterogenous single packaged systems. Eliyan will have… ....

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Eliyan raises $40m

Eliyan, which invented the highest-performance chiplet interconnect, has closed a Series A $40 million funding round, and taped out its technology on an ....

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Eliyan Closes $40M Series A Funding Round and Unveils Industry's Highest Performance Chiplet Interconnect Technologies – EEJournal

Company’s chiplet packaging method is critical to realizing the scale of performance and integration required in a broad range of compute-intensive applications for hyperscalers, data centers, cloud computing, AI, and graphic Series A funding round raises $40m led by Tracker Capital with additional investment from Celesta Capital and strategic investors including Intel Capital and Micron… ....

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