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JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration

JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration
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Mian quddusCliff grossnerSolid state technology associationNew releaseModel guidelinesEmpowering chipletState technology associationOpen compute project foundationData extensible markup languageOpen chiplet economyChief innovation officer

Eliyan Applauds Release of OCP s Latest Multi-die Open Interconnect Standard, BoW 2 0; Demonstrates Industry s First Working Silicon Compliant with the Spec

/PRNewswire/ Eliyan Corporation, credited for the invention of the semiconductor industry s highest-performance and most efficient chiplet interconnect,.

Bapi vinnakotaRamin fajadradPrnewswire eliyan corporationOpen compute projectOpen domain specific architectureMulti gbps enterprise ethernetOpen chiplet economyOpen compute project foundation