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Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generati

Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generati
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United statesMike sottakSanta claraTiger global managementEliyan corporationArete researchCalifornia newsfile corpSamsung catalyst fundIntel capitalCleveland avenueMesh venturesCatalyst fundSamsung electronicCelesta capitalMicron venturesTracker capital

Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips

Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
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United statesSanta claraMike sottakSamsung catalyst fundEliyan corporationTiger global managementArete researchReportable incIntel capitalCleveland avenueMesh venturesCatalyst fundSamsung electronicCelesta capitalMicron venturesTracker capital

Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era

Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era
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Santa claraMike sottakRamin farjadradUcie consortiumEliyan corporationSemiconductor engineering incTaiwan semiconductor manufacturing companyIntel corporationQualcomm incorporatedCalifornia newsfile corpSamsung electronicsMicrosoft corporationUniversal chiplet interconnect expressAdvanced semiconductor engineeringGoogle cloudTaiwan semiconductor manufacturing

Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era

Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era
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Ramin farjadradMike sottakUcie consortiumTaiwan semiconductor manufacturing companySamsung electronicsIntel corporationMicrosoft corporationEliyan corporationQualcomm incorporatedSemiconductor engineering incReportable incUniversal chiplet interconnect expressAdvanced semiconductor engineeringGoogle cloudTaiwan semiconductor manufacturing

Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era

/PRNewswire/ Eliyan Corporation, credited for the invention of the semiconductor industry s highest-performance and most efficient chiplet interconnect,.

Eliyan nulinkRamin farjadradJohn lorenzSoftware solutions at yole intelligenceEliyan corporationPrnewswire eliyan corporationSilicon interposersSenior analystSoftware solutionsOpen compute projectProcessor market monitor