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Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
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Igor Elkanovich , Glink Cowo , Sanjive Agarwala , Dan Kochpatcharin , Cadence Design Systems Inc , Global Unichip Corp , Ip Group At Cadence , Design Infrastructure Management Division , Cadence Design Systems , Global Unichip , Intelligent System Design , Intelligent System Design Strategy ,

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
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Sanjive Agarwala , Glink Cowo , Dan Kochpatcharin , Igor Elkanovich , Global Unichip Corp , Ip Group At Cadence , Cadence Design Systems Inc , Companies To Work , Design Infrastructure Management Division , Design Systems , Global Unichip , Intelligent System Design , Intelligent System Design Strategy , Cadence Design Systems ,

CADENCE DESIGN SYSTEMS, INC. : Stock Market News and Information | CDNS| US1273871087

Cadence 112G-LR SerDes silicon proven in GUC’s HBM3/GLink/CoWoS platform

. | April 26, 2023 ....

Igor Elkanovich , Glink Cowo , Dan Kochpatcharin , Sanjive Agarwala , Ip Group At Cadence , Design Infrastructure Management Division , Cadence Design Systems Inc , Companies To Work , Global Unichip Corp , Cadence Design Systems , Global Unichip , Intelligent System Design , Intelligent System Design Strategy , Intelligent System , Nc Stock Exchange , Press Release , N Cdns Us1273871087 ,

Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology – EEJournal

SAN JOSE, Calif., April 24, 2023 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology. Implemented on TSMC’s 3DFabric™ CoWoS-S silicon interposer technology, the IP offers ultra-high bandwidth density, efficient low-power performance and superior low latency, making it ideal for… ....

Debendra Das Sharma , Sanjive Agarwala , Cadence Design Systems Inc , Ip Group At Cadence , Ucie Consortium , Cadence Design Systems , Cadence Verification , Advanced Package , Intelligent System Design ,

Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC's N4P Process – EEJournal

Highlights: • DSP-based, flexible-rate SerDes IP is optimized for PPA for next-generation cloud networking, AI/ML, and 5G wireless applications • New architecture delivers exceptional ELR performance and enables system robustness for lossy and reflective channels • The IP supports ELR, LR, MR and VSR applications and provides a flexible power-saving capability over different channels SAN… ....

Dan Kochpatcharin , Sanjive Agarwala , Design Infrastructure Management Division , Cadence Design Systems Inc , Ip Group At Cadence , Cadence Design Systems , Extended Long Reach , Medium Reach , Very Short Reach , Cadence Intelligent System Design ,