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Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology – EEJournal

SAN JOSE, Calif., April 24, 2023 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology. Implemented on TSMC’s 3DFabric™ CoWoS-S silicon interposer technology, the IP offers ultra-high bandwidth density, efficient low-power performance and superior low latency, making it ideal for…

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Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology

Complete high-performance 2.5D package solution enables heterogeneous integration . | April 24, 2023

Sanjive agarwalaDebendra das sharmaCadence design systems incUcie consortiumCompanies to workIp group at cadenceCadence design systemsCadence verificationAdvanced packageIntelligent system designNc stock exchangePress releaseEterogeneous cdns us1273871087

Microchip Introduces New CXL™ Smart Memory Controllers for Data Center Computing Enabling Modern CPUs to Optimize Application Workloads

Microchip Introduces New CXL™ Smart Memory Controllers for Data Center Computing Enabling Modern CPUs to Optimize Application Workloads
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