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Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology – EEJournal

SAN JOSE, Calif., April 24, 2023 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology. Implemented on TSMC’s 3DFabric™ CoWoS-S silicon interposer technology, the IP offers ultra-high bandwidth density, efficient low-power performance and superior low latency, making it ideal for… ....

Debendra Das Sharma , Sanjive Agarwala , Cadence Design Systems Inc , Ip Group At Cadence , Ucie Consortium , Cadence Design Systems , Cadence Verification , Advanced Package , Intelligent System Design ,

Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology

Complete high-performance 2.5D package solution enables heterogeneous integration

. | April 24, 2023 ....

Sanjive Agarwala , Debendra Das Sharma , Cadence Design Systems Inc , Ucie Consortium , Companies To Work , Ip Group At Cadence , Cadence Design Systems , Cadence Verification , Advanced Package , Intelligent System Design , Nc Stock Exchange , Press Release , Eterogeneous Cdns Us1273871087 ,

Microchip Introduces New CXL™ Smart Memory Controllers for Data Center Computing Enabling Modern CPUs to Optimize Application Workloads

Microchip Introduces New CXL™ Smart Memory Controllers for Data Center Computing Enabling Modern CPUs to Optimize Application Workloads
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