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India's 360-degree strategy for semiconductors: Can it become one of the top 5 chip makers by 2029?

After decades of depending on other nations for semiconductors, India has adopted a 360-degree strategy aimed at making it one of the top 5 manufacturers of chips by 2029 - Issue Date: Apr 28, 2024

Mohali
Madhya-pradesh
India
Singapore
South-korea
Taiwan
China
Malaysia
Sanand
Gujarat
Bharat
Robert-noyce

IT Hardware: PC manufacturers meet MeitY officials on import curbs, seek solutions, ET Telecom

The meeting discussed proposed changes, like linking the import of IT hardware to the local manufacturing of a company value and its export value of electronic items, according to sources.

India
New-delhi
Delhi
Electronics-association
It-ministry
India-cellular
Bit-hardware
It-ministry
India-cellular-and-electronics-association
Cea
Deity

OSATs eyeing chiplet opportunities

ASE Technology and other OSATs capable of providing advanced packaging technology are all gearing up for a boom in demand for chiplets.

Taiwan
Jason-chang
Case-technology
Google
Microsoft
Nvidia
Intel
Advanced-packaging
Tse
Chiplet
Hips-components

TSMC opens new advanced backend fab

TSMC s Advanced Backend Fab 6, the foundry s first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration, has opened.

Zhunan
Jiangsu
China
Taiwan
Mark-liu
Nvidia
Backend-fab
Advanced-backend-fab
Zhunan-science-park
3dfabric
Advanced-packaging
Hips-components

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