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MediaTek Dimensity 1200 6nm SoC with Dual SIM 5G, up to 168Hz displays and Dimensity 1100 announced

MediaTek Dimensity 1200 6nm SoC with Dual SIM 5G, up to 168Hz displays and Dimensity 1100 announced MediaTek just announced Dimensity 1200 and Dimensity 1100, the company’s latest top-end SoCs with built-in 5G. These are the company’s first mobile chips to use TSMC’s 6nm process technology. The Dimensity 1200 has an octa-core CPU designed with an ultra-core Arm Cortex-A78 clocked up to 3GHz for extreme performance, three Arm Cortex-A78 super cores clocked up to 2.6GHz and four Arm Cortex-A55 efficiency cores clocked at 2GHz. This promises up to 22% faster CPU performance and 25% more power-effeciency compared to the previous generation. It has nine-core Mali-G77 GPU offering 13% increase in performance compared to the previous generation and six-core MediaTek APU 3.0.

MediaTek Launches 6nm Dimensity 1200 Premium 5G SoC

MediaTek Launches 6nm Dimensity 1200 Premium 5G SoC
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MediaTek Launches 6nm Dimensity 1200 Premium 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences

/PRNewswire/ MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for.

MediaTek Dimensity 1200, Dimensity 1100 5G Smartphone SoCs announced

MediaTek Dimensity 1200, Dimensity 1100 5G smartphone SoCs announced MediaTek Dimensity 1200, Dimensity 1100 5G smartphone SoCs announced Advertisement MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with built-in 5G. The first devices with the new MediaTek Dimensity 1200 and 1100 chipsets are expected to hit the market at the end of Q1 and beginning of Q2 this year. The Dimensity 1200 and 1100 pack a highly integrated 5G modem with MediaTek’s 5G UltraSave technology for big power savings. Both chipsets support every connectivity generation from 2G to 5G, in addition to supporting the latest connectivity features including 5G standalone and non-standalone architectures, 5G carrier aggregation (2CC) across frequency division duplex (FDD) and time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR). The chipsets also integrate 5G HSR Mode and 5G Elevator Mode enhancements

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