MediaTek Dimensity 1200, Dimensity 1100 5G smartphone SoCs announced
MediaTek Dimensity 1200, Dimensity 1100 5G smartphone SoCs announced
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MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with built-in 5G. The first devices with the new MediaTek Dimensity 1200 and 1100 chipsets are expected to hit the market at the end of Q1 and beginning of Q2 this year.
The Dimensity 1200 and 1100 pack a highly integrated 5G modem with MediaTek’s 5G UltraSave technology for big power savings. Both chipsets support every connectivity generation from 2G to 5G, in addition to supporting the latest connectivity features including 5G standalone and non-standalone architectures, 5G carrier aggregation (2CC) across frequency division duplex (FDD) and time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR). The chipsets also integrate 5G HSR Mode and 5G Elevator Mode enhancements to ensure a seamless, reliable 5G connection across networks.