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Siemens Collaborates with SPIL to Deliver a 3D Verification Workflow for Fan-out wafer-level Packaging
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Chipletz Selects Siemens EDA Solutions for its Smart Substrate IC Packaging Technology
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Siemens Digital Industries Software and UMC are to develop and implement a new multi-chip 3D IC planning, assembly validation and parasitic extraction
Siemens Collaborates with UMC to Develop 3D Integrated Circuit Hybrid Bonding Workflow
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Siemens, ASE Introduce Enablement Technologies for Next-Gen High Density Advanced Package Designs
Siemens Digital Industries Software has announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.
The new high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance – a program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs. ASE is a leading provider of independent semiconductor assembling and test manufacturing services.