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Newswire & Press Release / Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools, Optimize Other EDA Solutions for - Software - Siemens AG

Newswire & Press Release / Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools, Optimize Other EDA Solutions for - Software - Siemens AG
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United statesSiemen aprisaSiemen xpeditionSiemen tessentSiemens xceleratorSungjae leeSoftware announcementsSiemens digital industries softwareAgency sourceSolutions for foundry newestSoftware warningsCompact model coalitionDevelopment team at samsung electronicsSilicon systems for siemens digital industries softwareHigh density advanced packagingBanner ad here

Newswire & Press Release / Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools, Optimize Other EDA Solutions for - Software - Siemens AG

United statesSungjae leeSiemen aprisaSiemens xceleratorSiemen tessentSiemen xpeditionCompact model coalitionSoftware warningsSolutions for foundry newestSilicon systems for siemens digital industries softwareDevelopment team at samsung electronicsAgency sourceSiemens digital industries softwareSoftware announcementsHigh density advanced packagingBanner ad here

Design-Stage Analysis, Verification, and Optimization for Every Designer

Design-Stage Analysis, Verification, and Optimization for Every Designer
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Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel s EMIB reference flow – EEJournal

Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. Leveraging the expertise and world class technology of Siemens' industry leading IC and PCB design portfolios, Intel’s EMIB technology delivers advanced integrated…

Rahul goyalSiemens xceleratorPackage assembly design kitSiemens digital industries softwareIntel foundryVice presidentGeneral managerDesign ecosystemSubstrate integratorPackage designerElectronic board systemsSiemens digital industriesDigital industries software

Synopsys and Siemens Digital collaborate on Intel Foundries 18A process

Siemens Digital Industries Software says its Calibre Platform tool for IC design verification and its Analog FastSPICE (AFS) platform for analogue, RF,

Siemens digital industries softwarePackage assembly design kitSiemen analogIntel foundrySynopsys multi die system solutionDigital industries softwareSubstrate integratorXpedition package designer