Backside Power Delivery is seen as one of the most important technologies for future IC process improvements. Intel says it will introduce the technology
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Imec has presented an experimental demonstration of a routing scheme for logic ICs with backside power delivery enabled through nano-through-silicon-vias (
Imec has introduced the forksheet device architecture to extend the scalability of the nanosheet transistor family towards 1nm and beyond logic nodes. In a
At this week’s 2022 IEEE VLSI Symposium on Technology and Circuits, imec is presenting the first experimental demonstration of a routing scheme for logic ICs with backside power delivery enabled through nano-through-silicon-vias (nTSVs) landing on buried power rails (BPRs).