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70th IEDM: Call for Papers

2024 IEEE IEDM Call for Papers The Annual IEEE International Electron Devices Meeting will be held at the Hilton San Francisco Union Square in San

Heterogeneous integration of spin–photon interfaces with a CMOS platform

Colour centres in diamond have emerged as a leading solid-state platform for advancing quantum technologies, satisfying the DiVincenzo criteria1 and recently achieving quantum advantage in secret key distribution2. Blueprint studies3–5 indicate that general-purpose quantum computing using local quantum communication networks will require millions of physical qubits to encode thousands of logical qubits, presenting an open scalability challenge. Here we introduce a modular quantum system-on-chip (QSoC) architecture that integrates thousands of individually addressable tin-vacancy spin qubits in two-dimensional arrays of quantum microchiplets into an application-specific integrated circuit designed for cryogenic control. We demonstrate crucial fabrication steps and architectural subcomponents, including QSoC transfer by means of a ‘lock-and-release’ method for large-scale heterogeneous integration, high-throughput spin-qubit calibration and spectral tuning, and efficien

Engineering Researchers Report On Nanoscale Energy-Efficient Switching Devices

The development is significant because switching devices are at the heart of computing and communications technologies.

New 3-D Transistors Promising Future Chips, Lighter Laptops

New 3-D Transistors Promising Future Chips, Lighter Laptops
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