Contributing to technical innovation in optical and digital devices by solving the need for greater miniaturization and higher density mounting of semiconductors
[1] Bonding: Refers to shear strength (strength determined through application of a lateral load during testing)[2] Bumps: Protruding electrodes[3] Squeegees: Tools made from rubber or polyurethane resin that are used to scrape off excess material[4] Electroless plating: Refers to plating applied through a chemical reaction without using electricity; it enables plating of certain metals and precious metals, including copper,.
TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Group CEO: Koichiro Tanaka) will provide and donate pure gold, pure silver, and pure bronze medals .