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TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preform
Contributing to technical innovation in optical and digital devices by solving the need for greater miniaturization and higher density mounting of semiconductors
Chiyoda ku
Kikinzoku kogyo
Koichiro tanaka
Tokyo university of science
Density semiconductor mounting using aurofuse preform
Bonding technology for high
Bonding technology
High density semiconductor mounting using auro
Spring conference
Japan institute
Electronics packaging
Tokyo university
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