Intel is looking to new options for its future chips including 3D stacking of transistors to enable greater density, extending backside power, and use of…
LEUVEN (Belgium), DECEMBER 11, 2023 This week at the 2023 International Electron Devices Meeting (IEEE IEDM 2023), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, demonstrates a new method for faithfully splitting colors with sub-micron resolution using standard back-end-of-line processing on 300mm wafers. The technology is poised to elevate high-end camera…