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About EUROGUSS MEXICO Virtual Weeks 2021
With the growth of the automotive and metallurgical industry in Mexico, EUROGUSS MEXICO is the platform where international experts, users, suppliers and decision-making buyers shape the future and development of their sectors.
The on-site event at the Expo Guadalajara exhibition center will be replaced in 2021 by the EUROGUSS MEXICO Virtual Weeks, an online event several weeks long. The platform will be accessible and available to all users from April 27 until May 31, 2021
In the center of attention at the Virtual Weeks 2021 are:
Contacts
Innovations & Solutions
During the event experts and end users from the entire spectrum of the non-ferrous casting segment will be able to share information and network with one another in the virtual space.
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Home > Press > Knowledge and Power: Oxford Instruments Plasma Technology and LayTec join forces to provide critical front end processing solutions for the production of compound semiconductor devices
Abstract:
Two technology leaders within the compound semiconductor industry, Oxford Instruments Plasma Technology and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTecs accuracy and control with Oxford Instruments renowned wafer processing expertise.
Together, they will combine plasma process solutions with proven in-situ metrology to achieve next generation device performance and enable a repeatable HVM process to shorten customers yield ramp. LayTec will develop the in-situ metrology while Oxford Instruments will integrate LayTecs control with
Knowledge and Power: Oxford Instruments Plasma Technology and LayTec Join Forces to Provide Critical Front End Processing Solutions for the Production of Compound Semiconductor Devices
Two technology leaders within the compound semiconductor industry, Oxford Instruments Plasma Technology, and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTec’s accuracy and control with Oxford Instruments’ renowned wafer processing expertise.
Together, they will combine plasma process solutions with proven in-situ metrology to achieve next-generation device performance and enable a repeatable HVM process to shorten customers’ yield ramp. LayTec will develop the in-situ metrology while Oxford Instruments will integrate LayTec’s control with its advanced wafer processing solutions to deliver an enhanced solution