from leeds, our eduction editor branwen jeffreys reports on the results and the implications going forward. thank you forjoining us, let s celebrate. huge amounts of disruption over the last 18 months, these children have done remarkably well. , ,., , these children have done remarkably well. , , ., these children have done remarkably well. ., , ., these children have done remarkably well. absolutely, for young people who not well. absolutely, for young people who got their well. absolutely, for young people who got their results well. absolutely, for young people who got their results on well. absolutely, for young people who got their results on tuesday i well. absolutely, for young people| who got their results on tuesday or their results today, from people of all ages taking these exams and the teachers and the groups who support that damn, this is a big gate i it s absolutely a cause for celebration for lots of individuals who have got what they wanted and needed to go t
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Home > Press > Knowledge and Power: Oxford Instruments Plasma Technology and LayTec join forces to provide critical front end processing solutions for the production of compound semiconductor devices
Abstract:
Two technology leaders within the compound semiconductor industry, Oxford Instruments Plasma Technology and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTecs accuracy and control with Oxford Instruments renowned wafer processing expertise.
Together, they will combine plasma process solutions with proven in-situ metrology to achieve next generation device performance and enable a repeatable HVM process to shorten customers yield ramp. LayTec will develop the in-situ metrology while Oxford Instruments will integrate LayTecs control with
Knowledge and Power: Oxford Instruments Plasma Technology and LayTec Join Forces to Provide Critical Front End Processing Solutions for the Production of Compound Semiconductor Devices
Two technology leaders within the compound semiconductor industry, Oxford Instruments Plasma Technology, and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTec’s accuracy and control with Oxford Instruments’ renowned wafer processing expertise.
Together, they will combine plasma process solutions with proven in-situ metrology to achieve next-generation device performance and enable a repeatable HVM process to shorten customers’ yield ramp. LayTec will develop the in-situ metrology while Oxford Instruments will integrate LayTec’s control with its advanced wafer processing solutions to deliver an enhanced solution