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Home > Press > Knowledge and Power: Oxford Instruments Plasma Technology and LayTec join forces to provide critical front end processing solutions for the production of compound semiconductor devices
Abstract:
Two technology leaders within the compound semiconductor industry, Oxford Instruments Plasma Technology and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTecs accuracy and control with Oxford Instruments renowned wafer processing expertise.
Together, they will combine plasma process solutions with proven in-situ metrology to achieve next generation device performance and enable a repeatable HVM process to shorten customers yield ramp. LayTec will develop the in-situ metrology while Oxford Instruments will integrate LayTecs control with