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ERS electronic GmbH: ERS electronic introduces High Power Dissipation Thermal Chuck System, which can dissipate up to 2 5kW at -40°C for Embedded Processors, DRAM and NAND wafer test

ERS electronic GmbH: ERS electronic introduces High Power Dissipation Thermal Chuck System, which can dissipate up to 2 5kW at -40°C for Embedded Processors, DRAM and NAND wafer test
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ERS electronic introduces High Power Dissipation Thermal Chuck System, which can dissipate up to 2 5kW at -40°C for Embedded Processors, DRAM and NAND wafer test

/PRNewswire/ ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest.

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