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ERS electronic introduces High Power Dissipation Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test : comparemela.com
ERS electronic introduces High Power Dissipation Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test
/PRNewswire/ -- ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest...
Related Keywords
Aliang Wang
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Yunnan
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Shanghai
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Munich
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Bayern
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Germany
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Chinese
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Klemens Reitinger
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Vice President
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High Power Dissipation Chuck System
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Ers Electronic Gmbh
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