ERS electronic GmbH: ERS electronic introduces High Power Dissipation Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test

ERS electronic GmbH: ERS electronic introduces High Power Dissipation Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test

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