Purdue-CORIA named global industrial technology center in partnership with Korea purdue.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from purdue.edu Daily Mail and Mail on Sunday newspapers.
New institute accelerates future of microelectronic system integration, advanced packaging purdue.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from purdue.edu Daily Mail and Mail on Sunday newspapers.
Purdue launches institute for microelectronics development – Inside INdiana Business insideindianabusiness.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from insideindianabusiness.com Daily Mail and Mail on Sunday newspapers.
WEST LAFAYETTE – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems. The new institute, announced Wednesda .
From creating microchip ‘clocks’ to authoring a book series on semiconductors, Purdue continues to forge the future of microelectronics in 2023. Purdue University’s persistent pursuit of microchip advancement through the innovation, partnerships and programs highlighted in this roundup continues to move the field forward. If you have any questions or would like to speak to a Purdue expert, contact Brian Huchel, bhuchel@purdue.edu.