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New institute accelerates future of microelectronic system integration, advanced packaging

New institute accelerates future of microelectronic system integration, advanced packaging
purdue.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from purdue.edu Daily Mail and Mail on Sunday newspapers.

United statesPurdue universityWest lafayettePurdue jamesg dwyerMark lundstromNikhilesh chawlaDave henshallMitchelle daniels jrGanesh subbarayanBrian huchelLuc vanTom beckleyEric holcombTodd younkinKatsuaki suganumaUs department of defense

Purdue collaborates to bolster rapid technology development in U S

WEST LAFAYETTE – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems. The new institute, announced Wednesda .

Purdue universityUnited statesTodd younkinTom beckleyGanesh subbarayanMark lundstromLuc vanDave henshallPurdue jamesg dwyerNikhilesh chawlaEric holcombJohn underwoodKatsuaki suganumaIvy tech community collegeSemiconductor degrees programOsaka university

Research Bits: Nov 15

Research Bits: Nov 15
semiengineering.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from semiengineering.com Daily Mail and Mail on Sunday newspapers.

United statesZheng zhangNaoka nagamuraKatsuaki suganumaJapan national institute for materials scienceRd labNational institute for materials scienceLawrence berkeley national laboratoryMaterials sciences division at berkeley labUniversity of california berkeleyD lab at osaka universityD system integration laboratoryOsaka universityTokyo university of scienceSystem integration laboratoryCalifornia berkeley

Current events: Improved reliability of printed circuit boards

Current events: Improved reliability of printed circuit boards
asiaresearchnews.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from asiaresearchnews.com Daily Mail and Mail on Sunday newspapers.

Katsuaki suganumaSurface mount technology association international virtual conferenceOsaka universityInternational conference on device packagingInstitute of scientificIndustrial researchInternational conferenceDevice packaging

Chiplet integration technology with simplest scheme Scalability of inter-chip bandwidth and integration scale

Chiplet integration technology with simplest scheme Scalability of inter-chip bandwidth and integration scale
miragenews.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from miragenews.com Daily Mail and Mail on Sunday newspapers.

United statesToshiaki hirotaShinji wakisakaKatsuaki suganumaTakashi saitouIchiro konoYoichiro kuritaInstitute of innovative researchAoi electronics co ltdTokyo institute of technology techChiplet integration platform consortiumChiplet integration platform consortium onTohoku university associate professor takafumi fukushimaOsaka university specially appointed professorSpecially appointed professor yoichiro kuritaFuture interdisciplinary research