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Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology TOKYO, June 3, 2024 /PRNewswire/ Rapidus Corporation, a manufacturer of.

United statesMiki yagiAtsuyoshi koikeTakano okumotoDevan gillickKunihiko yasueIndustrial technology development organizationGeneration semiconductorsManufacturing technologyBreakaway communicationsJapan new energyRapidus corporationDevelopment of chipletPrnewswire rapidus corporationPackage designNew energy

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
tmcnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from tmcnet.com Daily Mail and Mail on Sunday newspapers.

United statesKunihiko yasueTakano okumotoDevan gillickAtsuyoshi koikeMiki yagiDevelopment of chipletPrnewswire rapidus corporationJapan new energyRapidus corporationBreakaway communicationsCollaboration to chiplet packaging technologyGeneration semiconductorsIndustrial technology development organizationManufacturing technologyChiplet packaging technology

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM , today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this.

United statesTakano okumotoDevan gillickKunihiko yasueAtsuyoshi koikeMiki yagiJapan new energyRapidus corporationDevelopment of chipletPrnewswire rapidus corporationManufacturing technologyIndustrial technology development organizationGeneration semiconductorsCollaboration to chiplet packaging technologyBreakaway communicationsChiplet packaging technology

Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab

Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab
anandtech.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from anandtech.com Daily Mail and Mail on Sunday newspapers.

United statesHenri richardAtsuyoshi koikeIntel foundrySamsung foundry

Rapidus to collaborate with Esperanto on AI ICs

Rapidus, the Japan government-backed startup focussed on 2nm process technology, is to collaborate with RISC-V specialist Esperanto Technologies on

Japan generalNew yorkUnited statesAtsuyoshi koikeDave ditzelEsperanto technologiesInnovative integrationChitose cityAlbany nanotech complex

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