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Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC – CIE


February 18, 2021
417 Views
congatec – a leading vendor of embedded and edge computing technology – focuses on customers’ ruggedization challenges at virtual embedded world 2021, presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules.
The solution portfolio for COM-HPC server modules is particularly impressive, tackling the fact that a significantly higher TDP must be mastered for these edge computing platforms, which represents a challenging task especially in the extended temperature range.
The driving force behind this focus is the increasing demand for rugged edge and real-time fog computing technologies to facilitate digitization projects in often extremely harsh and challenging environments. Typical use cases for these ultra-durable platforms can be found in critical railway, road traffic and smart city infrastructures, offshore rigs and wind parks, electricity distribution networ ....

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Extended Temperature Range Platforms for Edge Computing: From High-end COM-HPC to Low Power SMARC


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Extended Temperature Range Platforms for Edge Computing: From High-end COM-HPC to Low Power SMARC
February 18, 2021
Summary
congatec, a leading vendor of embedded and edge computing technology, focuses on customers’ ruggedization challenges at virtual embedded world 2021, presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. ....

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New state-of-the-art Computer-on-Modules – CIE


310 Views
congatec – a leading vendor of embedded and edge computing technologies – announces launch of 12 brand new Computer-on-Modules in parallel with today’s Intel IOTG (Internet of Things Group) launch of the 11th Gen Intel Core processors.
Based on the new low-power high-density Tiger Lake SoCs the new modules offer significantly greater CPU performance and nearly 3x higher GPU performance (1) along with state-of-the-art PCIe Gen4 and USB4 support. The new congatec COM-HPC and COM Express Computer-on-Modules will accelerate many performance hungry fanless edge applications in harsh industrial and embedded environments. Typical new edge computing tasks include industrial and tactile IoT, machine vision and situational awareness, real-time control and collaborative robotics, as well as real-time edge analytics and artificial intelligence (AI) with inference workloads enabled to run across all four new CPU cores, or on up to 96 graphics execution units of the bra ....

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