Live Breaking News & Updates on கனமான தாமிரம் குறைவாக வெப்ப மன அழுத்தம்

With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI). ....

Anylayer Zhuhai , Trx Pa Base Band Backplane Large , Consumer Products Development Trend Kinwong Technical Solution , G Development Trend Kinwong Technical Solution , High Layer Count Large Panel , High Tg Base Material , Development Trend Kinwong Technical Solution , Technology Capabilities , Multiple Technology Capabilities , Automotive Development Trend , Technical Solution , High Power , High Voltage , High Current , Thermal Management Solution , High Thermal Conductivity , Heavy Copper Less Thermal Stress , Autonomous Driving , Higher Transmission Rate , Slower Loss , High Frequency Millimeter Wave Radar , Raw Material , Blind Via , High Accuracy Copper Image Pattern , High Layer Registration , Large Size Display Screen ,