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Q&A Summary : Functional Products business (IR Business Briefing)

Q&A Summary of the IR Business Briefing of Furukawa Electric Co., Ltd. Date: June 9, 2023 14:45-15:45 Contents: Functional Products. | June 20, 2023

South koreaSouth koreanTakashi saitoShozo yanoAkihiro fukunagaMasaki ishikawaAccounting divisionMemory disk divisionManagement solution products division takashi moriPlastics divisionCopper foil divisionPlanning administration departmentProducts divisionFunctional productsCorporate senior vice presidentGeneral manager

Company discovers ingenious new process that could double the lifespan of lithium-ion batteries for EVs

“Röchling is always looking for the next stage in the evolution of electric vehicles and to support safety and sustainability goals."

United statesMarco barboliniInternational energy agencyThermal management solutionSouth americanGlobal product manager

Investegate |Cooper Standard Announcements | Cooper Standard: Cooper Standard s Thermoplastic Thermal Management Solution for Battery Electric Vehicles Wins SPE® Automotive Innovation Award

Investegate announcements from Cooper Standard, Cooper Standard’s Thermoplastic Thermal Management Solution for Battery Electric Vehicles Wins SPE® Automotive Innovation Award

Chris andrewsTom stimsonSociety of plastics engineersMotors coCooper standardAutomotive innovation awardPlastics engineersThermal management solutionAutomotive innovation awards galaManagement solutionInnovation awardsGrand awardInvestegate announcementsInvestegate company announcementsCooper standardQs and eqs

Cooper Standard s Thermoplastic Thermal Management Solution for Battery Electric Vehicles Wins SPE® Automotive Innovation Award

DJ Cooper Standard's Thermoplastic Thermal Management Solution for Battery Electric Vehicles Wins SPE® Automotive Innovation Award Cooper Standard Cooper Standard's Thermoplastic Thermal Management

Chris andrewsTom stimsonCompany websiteNews serviceSociety of plastics engineersMotors coThermoplastic thermal management solutionBattery electric vehicles winsAutomotive innovation awardStandard cooperPlastics engineersThermal management solutionCooper standardAutomotive innovation awards galaManagement solutionInnovation awards

Evertiq - The development trend of printed circuit board products a

With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).

United statesUnited kingdomAnylayer zhuhaiStates westcoastTrx pa base band backplane largeConsumer products development trend kinwong technical solutionG development trend kinwong technical solutionHigh layer count large panelHigh tg base materialDevelopment trend kinwong technical solutionTechnology capabilitiesMultiple technology capabilitiesHigh layer countAutomotive development trendTechnical solutionHigh power

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