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Sondrel selects Synopsys Fusion Design and Verification Platforms


Sondrel selects Synopsys Fusion Design and Verification Platforms
Sondrel has selected the Synopsys Fusion Design and Verification Continuum platforms to accelerate the design and verification of large, complex system-on-chip (SoC) designs.
Sondrel said that it plans to use solutions from Synopsys design and verification platforms to create power-efficient designs that will be focused on automotive, AI, machine learning, IoT, consumer AR/VR gaming, and security applications.
Synopsys s solutions were chosen by Sondrel to replace its legacy design systems. Synopsys track-record of power-efficient designs and power, performance and area metrics led to the company s decision in adopting its design and verification technologies enabling power-efficient SoC designs. ....

Sanjay Bali , Synopsys Fusion Design , Verification Continuum , Graham Curren , சஞ்சய் பாலி , சுருக்கம் இணைவு வடிவமைப்பு , சரிபார்ப்பு தொடர்ச்சி , கிரஹாம் கரேன் ,

A question of scale


A question of scale
Is Moore s Law dead, dying or in rude health? It depends who you ask. In turn, it depends on how they are applying the ruler when it comes to measuring the scaling factors as semiconductor processes move down the nanometre curve.
Together with colleagues from MIT, TSMC, UC Berkeley and his own institution, Philip Wong, professor of electrical engineering at Stanford University, wrote a paper for April s Proceedings of the IEEE on the progress made by silicon scaling and used it as the basis for his keynote at July s Design Automation Conference. In their view, Moore’s Law is still in operation but the assumptions that underpin it have changed. As a result, technologists should look far less at simple areal scaling of transistor footprints and spacing but take a view on the effective density of each successive node. ....

Gordon Moore , Philip Wong , Robert Dennard , International Electron Device Meeting , Stanford University , Design Automation , Electron Device Meeting , கோர்டந் மூர் , பிலிப் வோங் , ராபர்ட் டென்னர்ட் , சர்வதேச எதிர் மின்னணு சாதனம் சந்தித்தல் , ஸ்டான்போர்ட் பல்கலைக்கழகம் , வடிவமைப்பு ஆட்டோமேஷன் , எதிர் மின்னணு சாதனம் சந்தித்தல் ,

Aldec enhances Active-HDL to support new features


Aldec enhances Active-HDL to support new features
Aldec, a specialist in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has announced that it has enhanced Active-HDL to support new features within VHDL-2019 (IEEE 1076-2019).
These new features look to simplify the language, lift certain restrictions that were present in earlier versions and introduce new application programming interfaces (APIs).
Support has also been added for release 2020.08 of the open source VHDL verification methodology (OSVVM).
Active-HDL is an integrated design environment (IDE) that includes a full HDL and graphical design tool suite plus an RTL/gate-level simulator for the rapid deployment and verification of FPGAs. These features, combined with the latest revisions to VHDL, empower engineers to create, maintain, re-use and easily verify their designs. ....

Jim Lewis , Sunil Sahoo , Group Chair , Jim Lewis Director , ஜிம் லெவிஸ் , சுனில் சாஹூ , குழு நாற்காலி , ஜிம் லெவிஸ் இயக்குனர் ,

Hailo licenses NoC IP to accelerate dataflow performance


Hailo licenses NoC IP to accelerate dataflow performance
Hailo has licensed FlexNoC Interconnect IP and the accompanying Resilience Package for use in its AI processor targeting automotive, smart cities, smart retail, Industry 4.0 and other markets.
Developed by Arteris IP, a leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, Its FlexNoC products will be used by Hailo to improve the dataflow performance of its AI processor.
The processor is being used to transform visual intelligence and sensory perception for multiple industries by enabling smart devices to run neural network (NNs)-based applications more effectively at the edge.
“The Arteris IP FlexNoC interconnect is much more area efficient than competitive technologies,” explained Orr Danon, CEO of Hailo. “The state-of-the-art interconnect IP reduces the die area and power consumption of our unique architecture, whic ....

Orr Danon , K Charles Janac , Arteris Ip Flexno , Flexnoc Interconnect , Resilience Package , Its Flexnoc , Artificial Intelligence , Interconnect Ip , விரிதிறன் ப்யாகேஜ் , செயற்கை உளவுத்துறை , ஒன்றோடொன்று இணைக்கவும் இப் ,