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Imec s options to reduce metal line resistance at tight pitches

Imec has presented options to reduce the metal line resistance at tight metal pitches, mitigating the resistance/capacitance (RC) increase of future

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Imec Shows Path to Line Resistance Halving using Semi-Damascene with High-Aspect-Ratio Processing

LEUVEN (Belgium), June 30, 2022 This week, at the 2022 IEEE International Interconnect Technology Conference (IITC 2022), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents options to reduce the metal line resistance at tight metal pitches, mitigating the resistance/capacitance (RC) increase of future interconnects using direct metal patterning. For the…

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New Electronics - Semi-damascene with high-aspect-ratio processing reduces path to line resistance by half

imec has presented, at this year’s IEEE International Interconnect Technology Conference, a number of options that are able to reduce the metal line resistance at tight metal pitches, and in the process reduce the resistance/capacitance (RC) increase of future interconnects using direct metal patterning.

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Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test
semiengineering.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from semiengineering.com Daily Mail and Mail on Sunday newspapers.

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Intermetallics and airgaps for 1nm nodes and beyond

Intermetallics and airgaps for 1nm nodes and beyond
electronicsweekly.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from electronicsweekly.com Daily Mail and Mail on Sunday newspapers.

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