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Imec first to demonstrate conductor films on 300mm wafers with lower resistivity than Cu and Ru

LEUVEN (Belgium), MAY 23, 2023 This week, at the 2023 IEEE International Interconnect Technology Conference (2023 IEEE IITC), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, provides the first experimental evidence that the resistivity of a thin conductor film on a 300mm Si wafer can be lower than that of Cu…

What is Nanosecond Pulsed Laser Annealing?

Imec Shows Path to Line Resistance Halving using Semi-Damascene with High-Aspect-Ratio Processing

LEUVEN (Belgium), June 30, 2022 This week, at the 2022 IEEE International Interconnect Technology Conference (IITC 2022), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents options to reduce the metal line resistance at tight metal pitches, mitigating the resistance/capacitance (RC) increase of future interconnects using direct metal patterning. For the…

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