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The stacking of chiplets into a multifunctional 3D chip is among the many ways using which silicon designers are improving their capabilities.

T ai peiUnited statesMark liuAnirudh devganUs department of commerceputtingTaiwan semiconductor manufacturing coNvidia corpCadence design systems incCadence design systemsChief executive officer anirudh devganBloomberg newsSan joseCalifornia based cadenceSemicon taiwanScience actUs department of commerce