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Successful full-system die-to-wafer transfer at EVG's Heterogeneous Integration Competence Center demonstrates important step forward in achieving process maturity ST. FLORIAN, Austria, July 27, 2022 /PRNewswire/ EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using EVG's GEMINIFB automated hybrid bonding system. Such an accomplishment had been a key challenge for D2W bonding until today, as well as a major hurdle to scaling down the cost of implementing heterogeneous integration. This important industry achievement was carried out at EVG's Heterogeneous Integration Competence Center (HICC), which is designed to assist

Clemens schtteThomas uhrmannDavid morenoMarkus wimplingerSource ev groupPrnewswire ev groupHeterogeneous integration competence centerSky communicationsEv groupIntegration competence centerSuccessful full system die to wafer transfer at evg 39s heterogeneous integration competence center demonstrates important step forward in achieving process maturity st florianJuly 27022 prnewswire ev group evgA leading provider of wafer bonding and lithography equipment for the memsAnotechnology and semiconductor marketsOday announced it has achieveda major breakthrough in die to wafer d2w fusion and hybrid bonding by successfully demonstrating 100 percent void free yield of multiple different sizes froma complete 3d system ona chip soc ina single transfer process using evg 39s geminifb automated such an accomplishment had beena key challenge for until today