Successful full-system die-to-wafer transfer at EVG's Heterogeneous Integration Competence Center demonstrates important step forward in achieving process maturity ST. FLORIAN, Austria, July 27, 2022 /PRNewswire/ EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using EVG's GEMINIFB automated hybrid bonding system. Such an accomplishment had been a key challenge for D2W bonding until today, as well as a major hurdle to scaling down the cost of implementing heterogeneous integration. This important industry achievement was carried out at EVG's Heterogeneous Integration Competence Center (HICC), which is designed to assist
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom applications ST. FLORIAN, Austria and JERUSALEM
YES Joins Forces with EV Group
Competence Center in Austria
YES (
Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and More-than-Moore applications, today announced it is working with EV Group (https://www.evgroup.com/) and will install a YES EcoCoat monolayer coating system at EVG s NILPhotonics Competence Center in Austria. This collaboration will provide complete process flow demos for prospective semiconductor, life science and optical coatings (AR/VR) customers. EV Group is a major supplier of capital equipment for these markets. At YES, we aim to be the preferred technology solutions provider for material modification and surface enhancement. Achieving that goal means giving our customers, wherever they are located, what they need in order to create leading-edge products. We believe that this collaboration with EVG will help us to showcase our technologies to companies developing breakthroug