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Compound Catapult and SMD Semiconductor sign MoU

UK s CSA Catapult and Sarawak s SMD sign MoU

New Electronics - CSA Catapult and SMD Semiconductor sign landmark collaboration agreement

The Compound Semiconductor Applications (CSA) Catapult and SMD Semiconductor have signed a memorandum of understanding (MoU) to work together in the design, prototyping and manufacturing of next-generation semiconductor and compound semiconductor chips in the automotive and space industries.

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