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One-part toughened epoxy for dam-and-fill encapsulation

Latest News from the Electronics Industry - Electropages ....

Rohit Ramnath , Master Bond Supreme ,

One Part, Toughened Epoxy for Dam-and-Fill Encapsulation

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. ....

Maria Osipova , Rohit Ramnath , Master Bond Inc Jul , From Master Bond Inc Jul , Bond Supreme , Senior Product Engineer Rohit ,

UV Curing Adhesive Passes NASA Low Outgassing Specifications

Master Bond Inc. - UV Curing Adhesive Passes NASA Low Outgassing Specifications ....

Rohit Ramnath , Low Outgassing , Senior Product ,