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One Part, Toughened Epoxy for Dam-and-Fill Encapsulation

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. ....

Maria Osipova , Rohit Ramnath , Master Bond Inc Jul , From Master Bond Inc Jul , Bond Supreme , Senior Product Engineer Rohit ,

Thermally Conductive, Electrically Non-Conductive, Low Outgassing Epoxy

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. ....

Maria Osipova , Master Bond Inc , Master Bond Inc Jul , From Master Bond Inc Jul , Master Bond ,

Toughened One Part Epoxy Withstands Thermal Cycling

Master Bond EP17TF is a one part epoxy with a paste consistency, that can be readily dispensed evenly and uniformly. It has a moderately high glass transition temperature (Tg) of 150-155 °C and a wide service temperature range from -150 °F to +550 °F. ....

Maria Osipova , Master Bond Inc , Master Bond Inc Jul , From Master Bond Inc Jul , Master Bond , Bond High Strength , Thermal Cycling Resistant ,